Name
Title | ||
|---|---|---|
Potentialities of substrate-thinning technique to control minority carrier injection in smart power IC's |
Abstract | ||
|---|---|---|
This paper deals with the evaluation of a substrate-thinning technique as a way to control the substrate current issues. A test structure has been realized on a Smart Power Technology. Comprehension of the phenomena has been validated thanks to TCAD simulation. This technique was then applied to a commercial IC and the authors show that they succeeded to reduce by one decade the collected current on a victim, although the IC has already been optimized with classical solutions. |
Year | DOI | Venue |
|---|---|---|
2006 | 10.1016/j.mejo.2005.10.016 | Microelectronics Journal |
Keywords | Field | DocType |
Substrate-thinning technique,Substrate current protection,Smart power,TCAD simulation | Smart power technology,Power integrated circuits,Smart power,Computer Aided Design,Circuit design,Electronic engineering,Minority carrier injection,Engineering,Test structure,Electrical engineering | Journal |
Volume | Issue | ISSN |
37 | 8 | 0026-2692 |
Citations | PageRank | References |
0 | 0.34 | 1 |
Authors | ||
5 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| C. Lochot | 1 | 0 | 0.68 |
| J.P. Lainé | 2 | 0 | 0.34 |
| M. Bafleur | 3 | 7 | 7.06 |
| A. Cazarré | 4 | 0 | 0.68 |
| J. Tasselli | 5 | 0 | 0.68 |