Title
Electrical properties of hafnium silicate films obtained from a single-source MOCVD precursor
Abstract
In the present work, the potential of hafnium silicate (HfxSiyO2) films as an alternative gate dielectric to SiO2 for future technology generations is demonstrated. Thermally stable HfxSiyO2 films are deposited from a single-source MOCVD precursor. I–V and C–V measurement data are presented and effects of post-deposition annealing on electrical properties are discussed. A 900°C O2-anneal shows best results in terms of leakage current characteristics and is, therefore, intensively investigated.
Year
DOI
Venue
2005
10.1016/j.microrel.2004.11.040
Microelectronics Reliability
Keywords
Field
DocType
leakage current
Hafnium,Leakage (electronics),Electronic engineering,Gate dielectric,Metalorganic vapour phase epitaxy,Annealing (metallurgy),Engineering,Silicate
Journal
Volume
Issue
ISSN
45
5
0026-2714
Citations 
PageRank 
References 
3
0.68
0
Authors
6
Name
Order
Citations
PageRank
M. Lemberger141.75
Albena Paskaleva252.12
Stefan Zürcher341.07
Anton J. Bauer452.16
Lothar Frey5146.73
Heiner Ryssel652.16