Paper Info
Title
A novel routing algorithm for MCM substrate verification using single-ended probe
Abstract
Multi-chip Module (MCM) technology has become an important means to package high performance systems. However, wide usage of MCM technology has been restricted by the cost of design, fabrication and testing. Since electrical testing can cost as high as 50% of the MCM cost in the near future, an efficient MCM substrate test scheme is needed to ensure system reliability and reduce test cost. Numerous techniques are being pursued in the industry for testing unpopulated MCM substrates. Recently, a novel technique for testing MCM substrate using single-ended probe has been developed. In this paper, we present a heuristic algorithm to reduce the single-ended probe travel time in MCM substrate testing. Using our new novel heuristic algorithm, the test cost is dramatically reduced
Year
DOI
Venue
1998
10.1109/VTEST.1998.670879
VTS
Keywords
Field
DocType
integrated circuit reliability,routing algorithm,single-ended probe,multichip modules,heuristic algorithm,mcm substrate testing,cost,automatic testing,substrates,reliability,digital simulation,economics,multichip module,mcm substrate verification,system testing,packaging,fabrication,routing
Computer science,System testing,Heuristic (computer science),Automatic testing,Electronic engineering,Real-time computing,Electrical testing,Travel time,Fabrication,Embedded system,Routing algorithm
Conference
ISSN
ISBN
Citations 
1093-0167
0-8186-8436-4
0
PageRank 
References 
Authors
0.34
7
2
Name
Order
Citations
PageRank
Rongchang Yan100.34
Bruce C. Kim28921.11