Name
Title | ||
|---|---|---|
Investigation of diode geometry and metal line pattern for robust ESD protection applications |
Abstract | ||
|---|---|---|
The effect of different diode geometries and metal patterns on the failure current It2 is investigated experimentally. The devices considered are N+/P well LOCOS diodes having different lengths, widths, finger numbers, and metal connections. The results provide useful insights into optimizing the diode for robust electrostatic discharge (ESD) protection applications. |
Year | DOI | Venue |
|---|---|---|
2008 | 10.1016/j.microrel.2008.04.019 | Microelectronics Reliability |
Keywords | Field | DocType |
electrostatic discharge | LOCOS,Contact line,Electrostatic discharge,Diode,Electronic engineering,Engineering,Metal,Metallic bonding | Journal |
Volume | Issue | ISSN |
48 | 10 | 0026-2714 |
Citations | PageRank | References |
3 | 0.55 | 0 |
Authors | ||
3 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| You Li | 1 | 3 | 0.55 |
| Juin J. Liou | 2 | 51 | 20.34 |
| Jim Vinson | 3 | 3 | 0.55 |