Name
Abstract | ||
|---|---|---|
A 3D Heterogeneous Sensor using a stacked chip is investigated. Optical Active Pixel Sensor and IR Bolometer detectors are combined to create a multispectral pixel for aligned color and infrared imaging. An acoustic and seismic micromachined sensor array obtains sound spectral and directional information. For the optical/IR imagers fault tolerant APS cells and software methods are used for defect avoidance. For the acoustic/seismic array spare detectors are combined with signal processing to compensate for changes in detector positions due to defects. The sensor fault distribution in turn impacts the defect avoidance in the fault tolerant TESH networked processors analyzing the sensor array. |
Year | Venue | Keywords |
|---|---|---|
2004 | DFT | active pixel sensor,sensor array,seismic array,ir imagers fault tolerant,heterogeneous sensor,sensor fault distribution,defect avoidance,3-d heterogeneous sensor,ir bolometer detector,fault tolerant tesh,seismic micromachined sensor array,optical activity,chip,signal processing,fault tolerant,network processor |
DocType | ISBN | Citations |
Conference | 0-7695-2241-6 | 9 |
PageRank | References | Authors |
1.13 | 8 | 3 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Glenn H. Chapman | 1 | 167 | 34.10 |
| Vijay Jain | 2 | 50 | 13.06 |
| S. Bhansali | 3 | 30 | 8.09 |