Title
Effective Mobility And Interface-State Density Of La2o3 Nmisfets After Post Deposition Annealing
Abstract
In this paper, we reported the effective mobility and the interface-state density of La2O3 nMISFETs fabricated under different post deposition annealing (PDA) conditions; annealing temperature (300 degrees C-600 degrees C) and ambient (N-2 or O-2). High effective mobility of 312 cm(2)/Vs and low interface-state density of 6x10(10) cm(-2)/eV were obtained from La2O3 nMISFET with equivalent oxide thickness (EOT) of 1.7 nm after PDA at 300 degrees C in N-2 ambient for 10 minutes. Gate leakage current density was 6.8x10(-6) A/cm(2). We found that peak effective mobility decreased with increasing anneal temperature, regardless of annealing ambient. We also observed a monotonous relationship between effective mobility and interface-state density. This behavior suggests that lowering the interface-state density is essential to obtain high mobility in the high-kappa/Si structure.
Year
DOI
Venue
2006
10.1587/elex.3.316
IEICE ELECTRONICS EXPRESS
Keywords
Field
DocType
La2O3, PDA, nMISFET, mobility, interface-state density
Equivalent oxide thickness,Gate leakage current,Deposition (law),Computer science,Electronic engineering,Annealing (metallurgy)
Journal
Volume
Issue
ISSN
3
13
1349-2543
Citations 
PageRank 
References 
1
0.63
1
Authors
7
Name
Order
Citations
PageRank
Jin-Aun Ng110.63
Nobuyuki Sugii245.26
Kuniyuki Kakushima3911.63
Parhat Ahmet434.13
Kazuo Tsutsui569.26
Takeo Hattori611.98
Hiroshi Iwai71212.99