Name
Abstract | ||
|---|---|---|
In this paper, we present a novel algorithm for 3D floorplanning with fixed outline constraints and a particular emphasis on thermal awareness. A computationally efficient thermal model that can be used to guide the thermal-aware floorplanning algorithm to reduce the peak temperature is proposed. We also present a novel white space redistribution algorithm to dissipate hotspot. Thermal through-silicon via (TSV) insertion is performed during the floorplanning process as a means to control the peak temperature. Experimental results are very promising and demonstrate that the proposed floorplanning algorithm has a high success rate at meeting the fixed-outline constraints while effectively limiting the rise in peak temperature. |
Year | DOI | Venue |
|---|---|---|
2010 | 10.1109/ASPDAC.2010.5419822 | ASP-DAC |
Keywords | Field | DocType |
thermal awareness,novel algorithm,integrated circuit interconnections,proposed floorplanning algorithm,thermal through-silicon via insertion,three-dimensional integrated circuits,white space redistribution,computationally efficient thermal model,peak temperature,3d integrated circuits,novel white space redistribution,thermal through-silicon,fixed-outline thermal-aware,floorplanning process,thermal-aware floorplanning algorithm,integrated circuit layout,thermal-aware 3d floorplanning,resistance,interpolation,computational modeling,through silicon via,soc,heating,image recognition | Integrated circuit layout,Thermal model,White spaces,Thermal,Computer science,Interpolation,Car navigation systems,Electronic engineering,Limiting,Floorplan | Conference |
ISSN | ISBN | Citations |
2153-6961 | 978-1-4244-5767-0 | 15 |
PageRank | References | Authors |
0.70 | 8 | 4 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Linfu Xiao | 1 | 157 | 6.83 |
| Subarna Sinha | 2 | 198 | 20.80 |
| Jingyu Xu | 3 | 85 | 8.33 |
| Evangeline F. Y. Young | 4 | 995 | 83.54 |