Paper Info
Title
Comparison among emission and susceptibility reduction techniques for electromagnetic interference in digital integrated circuits
Abstract
This paper presents a comparative study of susceptibility reduction techniques for electromagnetic interference (EMI) in digital integrated circuits (ICs). Both direct power injection (DPI) and very-fast transmission-line pulsing (VF-TLP) methods are used to inject interference into the substrate of a single test chip. This IC is built around six functionally identical cores, differing only by their EMI protection strategies (RC protection, isolated substrate, meshed power supply network) which were initially designed for low emission design rules. The ranking of three of these cores in terms of electromagnetic immunity is then compared with the one of their radiated emission, thanks to near-field scanning (NFS) measurements. This leads to the establishing of design guidelines for low EMI in digital ICs.
Year
DOI
Venue
2008
10.1016/j.mejo.2008.02.022
Microelectronics Journal
Keywords
Field
DocType
isolated substrate,electromagnetic interference,direct power injection,electromagnetic immunity,digital integrated circuit,emi protection strategy,susceptibility reduction technique,rc protection,digital ics,design guideline,low emi,design rules,nfs,dpi,chip
Transmission line,Electromagnetic interference,Near and far field,Electronic engineering,Chip,Interference (wave propagation),Power electronics,Engineering,Electrical engineering,Effective radiated power,EMI
Journal
Volume
Issue
ISSN
39
12
Microelectronics Journal
Citations 
PageRank 
References 
3
0.59
4
Authors
8
Name
Order
Citations
PageRank
Ali Alaeldine140.99
Nicolas Lacrampe230.59
Alexandre Boyer3196.90
Richard Perdriau4158.64
Fabrice Caignet5797.99
Mohamed Ramdani676.54
E. Sicard710111.18
M'hamed Drissi8648.21