Abstract | ||
---|---|---|
Integrated circuit technology is causing system designs to move towards complex architectures, requiring communication channels characterised by ever increasing capacity. In this context, classical metallic interconnects become a bottleneck, owing to the power consumption, crosstalk and signal integrity issues. Integrated Substrate Waveguides (SIW) are a potential technological solution to overcome traditional interconnect limitations. In the paper the Authors present frequency and time domain analysis of these structures, comparing two different SIW structures in terms of time and signal dispersion performances. |
Year | Venue | Keywords |
---|---|---|
2007 | Nano-Net | integrated substrate waveguides,authors present frequency,integrated circuit technology,ultra-high speed interconnects,complex architecture,time domain analysis,integrated waveguides,different siw structure,communication channel,signal integrity issue,dispersion performance,classical metallic interconnects |
DocType | Citations | PageRank |
Conference | 0 | 0.34 |
References | Authors | |
0 | 4 |
Name | Order | Citations | PageRank |
---|---|---|---|
Davide Urbano | 1 | 0 | 0.34 |
Emilio Arnieri | 2 | 0 | 1.69 |
Gregorio Cappuccino | 3 | 36 | 10.11 |
Giandomenico Amendola | 4 | 0 | 2.03 |