Title
Compact Modeling Of Expansion Effects In Ldmos
Abstract
In LDMOS devices for high-voltage applications, there appears a notable fingerprint of current-voltage characteristics known as soft breakdown. Its mechanism is analyzed and modeled on LDMOS devices where a high resistive drift region exists. This analysis has revealed that the softness of breakdown, known as the expansion effect, withholding a run-away of current, is contributed by the flux of holes underneath the gate-overlap region originated by impact-ionization. The mechanism of the expansion effect is modeled and implemented into the compact model HiSIM_HV for circuit simulation. A good agreement between simulated characteristics and 2D-device simulation results is verified.
Year
DOI
Venue
2012
10.1587/transele.E95.C.1817
IEICE TRANSACTIONS ON ELECTRONICS
Keywords
Field
DocType
high-voltage MOSFETs, breakdown, high-electric-field phenomena, compact model, surface potential
LDMOS,Electronic engineering,Engineering,Optoelectronics
Journal
Volume
Issue
ISSN
E95C
11
1745-1353
Citations 
PageRank 
References 
0
0.34
0
Authors
9