Name
Abstract | ||
|---|---|---|
Die stacking is a promising new technology that enables integration of devices in the third dimension. It allows the stacking of multiple active layers directly on top of one another with short, dense die-to-die vias providing communication. Previous work has shown significant benefits at all design targets, from stacking memory on logic to partitioning individual architectural units across multiple layers. Many high-speed processor units-ALUs, register files, caches, and instruction schedulers-have all been designed in 3D, achieving significant, simultaneous power savings and performance boosts. Other work has looked at the implementation of network-on-chip in a die stack but restricted the focus to planar designs of the various unit(processors, routers, etc.). This work follows up on these two re-search areas to explore the 3D design of router components, specifically the crossbar. We examine the implementation of a crossbar and two multistage interconnect networks to determine the potential benefits of 3D implementations. Compared to equivalent planar designs,we achieve a maximum delay reduction of 26% and maximum power savings of 24%. |
Year | DOI | Venue |
|---|---|---|
2009 | 10.1109/ISVLSI.2009.53 | Tampa, FL |
Keywords | Field | DocType |
noc,flexible baseband processor,min design,3d integration,high performance non-blocking switch,die-stacking technology,heterogeneous set,crossbar design,die-stacking,scalable communications core,3-ary 2-cube network-on-chip,programmable accelerator,multiple wireless,crossbar,high performance computing,network on chip,very large scale integration,network on a chip,moore s law,stacking,integrated circuit design,switches | Computer architecture,Supercomputer,Network on a chip,Integrated circuit design,Router,Engineering,Very-large-scale integration,Crossbar switch,Moore's law,Stacking,Embedded system | Conference |
ISSN | ISBN | Citations |
2159-3469 | 978-0-7695-3684-2 | 4 |
PageRank | References | Authors |
0.52 | 14 | 3 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Dean L. Lewis | 1 | 312 | 15.89 |
| Sudhakar Yalamanchili | 2 | 1836 | 184.95 |
| Hsien-Hsin Sean Lee | 3 | 1657 | 102.66 |