Name
Abstract | ||
|---|---|---|
Modern semiconductor process technologies enable the manufacturing of a complete system on one single die, the so-called system-on-chip or SOC. Building those chips in a timely and cost-effective manner is amongst others realized by embedding third-party IP cores. Due to imperfections in silicon manufacturing, an SOC including all its embedded modules needs to be tested for manufacturing defects. |
Year | DOI | Venue |
|---|---|---|
2005 | 10.1109/ATS.2005.67 | Asian Test Symposium |
Keywords | Field | DocType |
modern semiconductor process technology,cost-effective manner,single die,ieee std,compliant infrastructure formodular soc,silicon manufacturing,third-party ip core,embedded module,so-called system-on-chip,complete system,chip,cost effectiveness,system on chip,system on a chip,marine technology,system testing,silicon | Marine technology,System on a chip,Embedding,Computer science,Logic testing,System testing,Semiconductor device fabrication,Electronic engineering,Embedded system | Conference |
ISSN | ISBN | Citations |
1081-7735 | 0-7695-2481-8 | 3 |
PageRank | References | Authors |
0.40 | 0 | 3 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Tom Waayers | 1 | 128 | 11.47 |
| Erik Jan Marinissen | 2 | 2053 | 170.58 |
| Maurice Lousberg | 3 | 438 | 44.12 |