Name
Abstract | ||
|---|---|---|
This paper presents a new technique that takes advantage of the differing temperature dependences in low-voltage interconnect links and higher voltage transceivers. The link and transceiver are dynamically retimed as the system temperature changes. This delay borrowing enables the link to maintain a frequency requirement despite temperature-induced frequency variations in excess of 200%, and enables the link to operate at lower voltages than possible with a non-temperature aware link. In addition to improved tolerance of environmental variations, the proposed approach achieves energy savings of up to 40% in a commercial 65 nm technology, including the energy overhead of the temperature-aware system. Further, the delay borrowing system is shown to decrease temperature-induced delay variations by 85%. |
Year | DOI | Venue |
|---|---|---|
2010 | 10.1109/NOCS.2010.20 | NOCS |
Keywords | Field | DocType |
frequency requirement,energy-efficient low-voltage link design,energy saving,non-temperature aware link,system temperature change,temperature-induced delay variation,temperature dependence,temperature-aware delay borrowing,delay borrowing system,energy overhead,temperature-aware system,delay borrowing,low voltage,network on a chip,transceivers,frequency,temperature,energy efficiency,interconnect,energy efficient,power dissipation | Transceiver,Dissipation,Efficient energy use,Computer science,Voltage,Network on a chip,Real-time computing,Low voltage,Link design,Interconnection | Conference |
Citations | PageRank | References |
4 | 0.45 | 31 |
Authors | ||
3 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| David H. Wolpert | 1 | 4334 | 591.07 |
| Bo Fu | 2 | 364 | 39.23 |
| Paul Ampadu | 3 | 285 | 28.55 |