Title
Early estimation of TSV area for power delivery in 3-D integrated circuits.
Year
DOI
Venue
2010
10.1109/3DIC.2010.5751467
3DIC
Keywords
Field
DocType
chip,through silicon via,estimation theory,power dissipation,integrated circuit design,algorithm design and analysis,iterative algorithm,integrated circuit,benchmark testing,iterative methods
Algorithm design,Iterative method,Electronic engineering,Integrated circuit design,Engineering,Estimation theory,Integrated circuit,Die (integrated circuit),Design space exploration,Benchmark (computing)
Conference
Citations 
PageRank 
References 
2
0.38
7
Authors
3
Name
Order
Citations
PageRank
Nauman H. Khan1584.21
Sherief Reda2128392.25
Soha Hassoun3535241.27