Paper Info
Title
Faster IC Analysis with PICA Spatial Temporal Photon Correlation and CAD Autochanneling
Abstract
To reduce PICA (Picosecond Imaging Circuit Analysis) acquisition time, we have developed a Spatial Temporal Photon Correlation approach (STPC-3D). Using a reduced CAD layout, the area where light emission may be detected is calculated in the CAD autochanneling process. Acquisition time is cut down from hours to minutes. A case study highlighting the significant time reduction for fault localization with PICA is presented in the document. (C) 2003 Elsevier Ltd. All rights reserved.
Year
DOI
Venue
2003
10.1016/S0026-2714(03)00300-7
Microelectronics Reliability
Field
DocType
Volume
CAD,Photon,Electronic engineering,Correlation,Engineering
Journal
43
Issue
ISSN
Citations 
9
0026-2714
0
PageRank 
References 
Authors
0.34
0
8
Name
Order
Citations
PageRank
R. Desplats14015.34
A. Eral200.34
F. Beaudoin32010.73
P. Perdu46027.38
A. Weger563.18
M. McManus600.34
Peilin Song730249.35
Franco Stellari87716.23