| CADless laser assisted methodologies for failure analysis and device reliability | 1 | 0.59 | 2010 |
| Magnetic microscopy for ground plane current detection: a fast and reliable technique for current leakage localization by means of magnetic simulations | 0 | 0.34 | 2010 |
| Analysis of deep submicron VLSI technological risks: A new qualification process for professional electronics | 1 | 0.37 | 2009 |
| Magnetic microscopy for 3D devices: Defect localization with high resolution and long working distance on complex system in package | 6 | 1.16 | 2009 |
| Analysis of traps effect on AlGaN/GaN HEMT by luminescence techniques | 5 | 1.80 | 2008 |
| Fast and rigorous use of thermal time constant to characterize back end of the line test structure in advanced technology | 1 | 0.48 | 2008 |
| Effect of physical defect on shmoos in CMOS DSM technologies | 3 | 0.83 | 2008 |
| Failure Analysis enhancement by evaluating the Photoelectric Laser Stimulation impact on mixed-mode ICs | 0 | 0.34 | 2008 |
| Dynamic study of the thermal laser stimulation response on advanced technology structures | 1 | 0.75 | 2008 |
| Dynamic laser stimulation techniques for advanced failure analysis and design debug applications | 2 | 1.46 | 2007 |
| Long-term reliability of silicon bipolar transistors subjected to low constraints | 0 | 0.34 | 2007 |
| Study of passivation defects by electroluminescence in AlGaN/GaN HEMTS on SiC | 2 | 2.16 | 2007 |
| Time resolved imaging using synchronous picosecond Photoelectric Laser Stimulation | 2 | 0.68 | 2006 |
| Descrambling and data reading techniques for flash-EEPROM memories. Application to smart cards | 4 | 0.42 | 2006 |
| Application of various optical techniques for ESD defect localization | 1 | 0.44 | 2006 |
| Different Failure signatures of multiple TLP and HBM Stresses in an ESD robust protection structure | 0 | 0.34 | 2005 |
| Failure analysis of micro-heating elements suspended on thin membranes | 1 | 0.48 | 2005 |
| NIR laser stimulation for dynamic timing analysis | 2 | 0.45 | 2005 |
| Dynamic Laser Stimulation Case Studies | 2 | 0.62 | 2005 |
| Impact of semiconductors material on IR Laser Stimulation signal | 0 | 0.34 | 2005 |
| Oxide charge measurements in EEPROM devices | 3 | 0.41 | 2005 |
| Light Emission to Time Resolved Emission For IC Debug and Failure Analysis | 5 | 1.25 | 2005 |
| Electrical Modeling for Laser Testing with Different Pulse Durations | 5 | 1.01 | 2005 |
| Magnetic Microscopy for IC Failure Analysis: Comparative Case Studies using SQUID, GMR and MTJ systems. | 0 | 0.34 | 2004 |
| From Static Thermal and Photoelectric Laser Stimulation (TLS/PLS) to Dynamic Laser Testing | 2 | 0.72 | 2003 |
| Magnetic emission mapping for passive integrated components characterisation | 0 | 0.34 | 2003 |
| Time Resolved Photoemission (PICA) – From the Physics to Practical Considerations | 0 | 0.34 | 2003 |
| Solar Cell Analysis with Light Emission and OBIC Techniques | 0 | 0.34 | 2003 |
| Characterization of ESD induced defects using Photovoltaic Laser Stimulation (PLS) | 0 | 0.34 | 2003 |
| Faster IC Analysis with PICA Spatial Temporal Photon Correlation and CAD Autochanneling | 0 | 0.34 | 2003 |
| Short defect characterization based on TCR parameter extraction | 0 | 0.34 | 2003 |
| TCAD and SPICE modeling help solve ESD protection issues in analog CMOS technology | 0 | 0.34 | 2003 |
| A physical approach on SCOBIC investigation in VLSI | 0 | 0.34 | 2003 |
| Thermal laser stimulation and NB-OBIC techniques applied to ESD defect localization | 0 | 0.34 | 2003 |
| Magnetic field measurements for Non Destructive Failure Analysis | 0 | 0.34 | 2002 |
| Backside Defect Localizations and Revelations Techniques on Gallium Arsenide (GaAs) Devices | 0 | 0.34 | 2002 |
| IR confocal laser microscopy for MEMS Technological Evaluation. | 1 | 0.51 | 2002 |
| Reliability Defect Monitoring with Thermal Laser Stimulation: Biased Versus Unbiased | 2 | 0.76 | 2002 |
| Backside Hot Spot Detection Using Liquid Crystal Microscopy | 0 | 0.34 | 2002 |
| Backside Localization of Current Leakage Faults Using Thermal Laser Stimulation | 3 | 1.05 | 2001 |
| Silicon Thinning and Polishing on Packaged Devices | 3 | 1.63 | 2001 |
| Front Side and Backside OBIT Mappings applied to Single Event Transient Testing | 1 | 0.63 | 2001 |
| Modeling Thermal Laser Stimulation | 1 | 0.63 | 2001 |
