Name
Title | ||
|---|---|---|
Optimization of an on-chip active cooling system based on thin-film thermoelectric coolers |
Abstract | ||
|---|---|---|
In this paper, we explore the design and optimization of an on-chip active cooling system based on thin-film thermoelectric coolers (TEC). We start our investigation by establishing the compact thermal model for the chip package with integrated thin-film TEC devices. We observe that deploying an excessive number of TEC devices and/or providing the TEC devices with an improper supply current might adversely result in the overheating of the chip, rendering the cooling system ineffective. A large amount of supply current could even cause the thermal runaway of the system. Motivated by this observation, we formulate the deployment of the integrated TEC devices and their supply current setting as a system-level design problem. We propose a greedy algorithm to determine the deployment of TEC devices and a convex programming based scheme for setting the supply current levels. Leveraging the theory of inverse-positive matrix, we provide an optimality condition for the current setting algorithm. We have tested our algorithms on various benchmarks. We observe that our algorithms are able to determine the proper deployment and supply current level of the TEC devices which reduces the temperatures of the hot spots by as much as 7.5??C compared to the cases without integrated TEC devices. |
Year | DOI | Venue |
|---|---|---|
2010 | 10.1109/DATE.2010.5457225 | DATE |
Keywords | Field | DocType |
supply current setting,supply current,current level,integrated thin-film tec device,system-level design,cooling system,cooling,chip package,integrated thin-film,matrix algebra,inverse-positive matrix,convex programming,supply current level,greedy algorithm,thin film circuits,tec device,integrated tec device,chip overheating,greedy algorithms,thermoelectric devices,improper supply current,integrated circuit packaging,on-chip active cooling system,compact thermal model,thin-film thermoelectric coolers,current setting algorithm,thin-film thermoelectric cooler,mathematical model,transistors,thin film,bloom filter,heating,optimization,packaging,system on a chip,hot spot,dfa,silicon,thermoelectricity,thermal conductivity,design optimization,system level design,chip,deep packet inspection | System on a chip,Computer science,Active cooling,Integrated circuit packaging,Chip,Overheating (economics),Electronic engineering,Water cooling,TEC,Thermoelectric cooling | Conference |
ISSN | ISBN | Citations |
1530-1591 | 978-1-4244-7054-9 | 7 |
PageRank | References | Authors |
0.79 | 3 | 3 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Jieyi Long | 1 | 129 | 8.98 |
| Seda Öǧrenci Memik | 2 | 488 | 42.57 |
| Matthew Grayson | 3 | 7 | 0.79 |