Title
On compaction utilizing inter and intra-correlation of unknown states
Abstract
Unknown (X) states are increasingly often identified as having potential for rendering semiconductor tests useless. One of the key requirements for a reliable test response compactor is, therefore, to preserve observability of any scan cell for a wide range of X-profiles while maintaining very high-compaction ratios, providing ability to detect a variety of failures found in real silicon, and assuring design simplicity. We have proposed a fully X-tolerant test response compaction scheme which is based on a flexible scan chain selection mechanism. This new approach delivers extremely high compression of test results by observing that X states are typically not randomly distributed in test responses. Identical or similar patterns of correlated X states let the proposed scheme reduce the size of a scan chain selector and the amount of test data used to control it. It handles, moreover, a wide range of unknown state profiles such that all X states, including those being clustered and of high density, are suppressed in a per-cycle mode without compromising the test quality.
Year
DOI
Venue
2010
10.1109/TCAD.2009.2035550
IEEE Trans. on CAD of Integrated Circuits and Systems
Keywords
DocType
Volume
compaction utilizing inter,test result,unknown state,test quality,test data,correlated X state,semiconductor test,X-tolerant test response compaction,wide range,test response,X state,reliable test response compactor
Journal
29
Issue
ISSN
Citations 
1
0278-0070
15
PageRank 
References 
Authors
0.61
28
5
Name
Order
Citations
PageRank
Dariusz Czysz12028.21
Grzegorz Mrugalski250135.90
Nilanjan Mukherjee380157.26
Janusz Rajski42460201.28
Jerzy Tyszer583874.98