Title
Global Built-In Self-Repair for 3D memories with redundancy sharing and parallel testing.
Year
DOI
Venue
2011
10.1109/3DIC.2012.6262967
3DIC
Keywords
Field
DocType
design for testability,computer architecture,maintenance engineering,redundancy,integrated circuit design,decoding
Design for testing,High memory,Computer science,Parallel computing,Redundancy (engineering),Integrated circuit design,Bandwidth (signal processing),Decoding methods,Maintenance engineering,Embedded system,Built-in self-test
Conference
Citations 
PageRank 
References 
9
0.54
19
Authors
3
Name
Order
Citations
PageRank
Xiaodong Wang11357192.86
Dilip P. Vasudevan2808.00
Hsien-Hsin Sean Lee31657102.66