Title
A built-in test circuit for open defects at interconnects between dies in 3D ICs.
Year
DOI
Venue
2011
10.1109/3DIC.2012.6263041
3DIC
Keywords
Field
DocType
testing,logic gates,cmos integrated circuits
Boundary scan,Discrete circuit,Circuit extraction,Circuit design,Electronic engineering,Engineering,Mixed-signal integrated circuit,Electronic circuit,Small Outline Integrated Circuit,Electrical engineering,Diode-or circuit
Conference
Citations 
PageRank 
References 
0
0.34
8
Authors
5
Name
Order
Citations
PageRank
Widianto100.34
Hiroyuki Yotsuyanagi27019.04
Akira Ono300.34
Masao Takagi400.34
Masaki Hashizume59827.83