Paper Info
Title
A novel dual-axis electrostatic microactuation system for micromanipulation
Abstract
This paper presents the design, fabrication, modeling, and control of a dual-axis electrostatic microactuation system. To form the 3D structure only three masks are used on silicon-on-insulator wafers using deep reactive ion etching. The bulk micromachined high aspect ratio structure produces large force output, achieving the full motion range with 10.7 V in x and 70.1 V in y. To provide position feedback for high precision manipulation, a capacitive position sensing mechanism, capable of resolving position changes up to 5 μm with a resolution of 0.01 μm in both x and y is integrated. A nonlinear model inversion technique is proposed for nonlinear electrostatic microactuation system identification and improving system linearity and response. The effectiveness of the technique was verified in experiments. Applications of the system include micromanipulation and microassembly.
Year
DOI
Venue
2002
10.1109/IRDS.2002.1044016
IROS
Keywords
Field
DocType
fabrication,electrostatic actuators,nonlinear model inversion,sputter etching,capacitive sensors,position feedback,capacitive position sensor,micromanipulators,masking,silicon-on-insulator,micromanipulation,microassembly,position control,deep reactive ion etching,silicon-on-insulator wafers,dual-axis electrostatic microactuation system,electrostatics,silicon on insulator,system identification,micromachining,linearity,atomic force microscopy,servomotors,etching,high aspect ratio
Silicon on insulator,Wafer,Nonlinear system,Computer science,Linearity,Deep reactive-ion etching,Control engineering,Capacitive sensing,System identification,Fabrication
Conference
Volume
Citations 
PageRank 
2
1
0.66
References 
Authors
2
7
Name
Order
Citations
PageRank
Yu Sun141869.89
Damrongrit Piyabongkarn2285.65
A. Serdar Sezen383.43
Bradley J. Nelson41263202.74
Rajesh Rajamani545888.34
Reto Schoch610.66
David P. Potasek721.38