Name
Title | ||
|---|---|---|
Effects of Cu on the interfacial reactions between Sn-8Zn-3Bi-xCu solders and Cu substrate. |
Abstract | ||
|---|---|---|
•The effect of Cu addition on the interfacial reaction between Sn–8Zn–3Bi solder and Cu substrate was investigated.•Cu–Zn IMCs form in the solder matrix when Cu was added.•Cu addition was beneficial in decreasing the thickness of IMC layers and increasing the activation energy. |
Year | DOI | Venue |
|---|---|---|
2014 | 10.1016/j.microrel.2013.10.001 | Microelectronics Reliability |
DocType | Volume | Issue |
Journal | 54 | 1 |
ISSN | Citations | PageRank |
0026-2714 | 0 | 0.34 |
References | Authors | |
0 | 3 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Lijuan Liu | 1 | 0 | 0.68 |
| Ping Wu | 2 | 0 | 0.68 |
| Wei Zhou | 3 | 34 | 5.88 |