Title
A Novel Massively Parallel Testing Method Using Multi-Root for High Reliability
Abstract
Wafer testing (wafer sort) is used in the semiconductor industry to reduce test costs. High parallelism is important to reduce test application time. However, increasing parallelism is becoming more difficult because the elements that drive test costs are increases in the pin count of the system on chip (SOC), and required automated test equipment (ATE) channels. While the need for parallelism has been growing, a reliability problem in which fault distribution causes good devices under test (DUT) to be improperly tested is becoming a concern. To achieve high parallelism and reliability, we propose a novel, massively parallel testing method using multi-root. In addition, we develop a test setup for setting the root-DUT location and the path of all DUTs. Using the proposed wafer testing method, test data can be transferred between the ATE and dies using multi-roots. The experimental results using ITC 02 SOC benchmarks show that the proposed method can reduce test costs up to 90%, and achieve nearly 94.84% test reliability without affecting yield.
Year
DOI
Venue
2015
10.1109/TR.2014.2336395
IEEE Transactions on Reliability
Keywords
Field
DocType
wafer level packaging,system on chip,automated test equipment channels,reduced pin-count testing (rpct),devices under test,semiconductor technology,multi-site test,automatic test equipment,semiconductor device reliability,system-on-chip,multiroot,semiconductor device testing,high reliability,test reliability,parallel testing method,massively parallel testing (mpt),test cost reduction,wafer-scale integration,wafer testing,stimuli broadcast,semiconductor industry,fault distribution,very large scale integration,testing,parallel processing
System on a chip,Massively parallel,Automatic test equipment,Communication channel,Wafer testing,Test data,Test compression,Very-large-scale integration,Reliability engineering,Mathematics,Embedded system
Journal
Volume
Issue
ISSN
64
1
0018-9529
Citations 
PageRank 
References 
3
0.41
15
Authors
3
Name
Order
Citations
PageRank
Haksong Kim130.41
Yong Lee 0002240.80
Sungho Kang343678.44