Title
A 3 Dimensional Built-In Self-Repair Scheme for Yield Improvement of 3 Dimensional Memories
Abstract
A 3-dimensional Built-In Self-Repair (3D BISR) scheme is proposed for 3-dimensional (3D) memories. The proposed 3D BISR scheme consists of two phases: a parallel test-repair phase, and a serial test-repair phase. After all memory dice are simultaneously tested, only the faulty memory dice are serially tested and repaired using one Built-In Redundancy Analysis (BIRA) module. Thus, it is a faster test-repair with low area overhead. The proposed BIRA algorithm with a post-share redundancy scheme performs exhaustive searches for all combinations of spare rows and columns. Experimental results show that the proposed 3D BISR is up to two times faster than the 3D serial test-serial repair BISR when seven 2048 2048 bit memory dice are stacked. The proposed 3D BISR requires 44.55% of the area in comparison to a 3D parallel test-parallel repair BISR for four stacked memory dice (one 128 K RAM, two 256 K RAMs, and 512 K RAM). The yield of 3D memories is the highest due to the exhaustive search BIRA algorithm with the post-share redundancy scheme as shown in various experimental results.
Year
DOI
Venue
2015
10.1109/TR.2015.2410274
Reliability, IEEE Transactions  
Keywords
Field
DocType
3d built-in self-repair,3d memory,area overhead,built-in redundancy analysis,built-in self-test,repair rate,yield,redundancy,maintenance engineering,computer aided manufacturing
Row and column spaces,Brute-force search,Parallel computing,Redundancy (engineering),Built in self repair,Dice,Mathematics,Built-in self-test
Journal
Volume
Issue
ISSN
PP
99
0018-9529
Citations 
PageRank 
References 
7
0.49
19
Authors
4
Name
Order
Citations
PageRank
Wooheon Kang1223.46
Changwook Lee2207.88
Hyunyul Lim3204.46
Sungho Kang443678.44