Title
Crosstalk Rejection in 3D-stacked Inter-Chip Communication with Blind Source Separation
Abstract
A blind source separation (BSS) is proposed to re-ject the crosstalk between inductive coupling channels in 3-D system. The phase and permutation ambiguities inherent to BSS are compensated for in the proposed technique. A continuous time natural gradient BSS with integrator output swing bound-ing, amenable for high-speed implementation, is also proposed. Techniques to reduce the implementation complexity for a large channel array are presented. The proposed technique shows substantial improvement results for crosstalk rejection in high crosstalk coupling environment. Also for a 3x3 array channel with 1 Gb/s/channel with crosstalk-to-signal ratio of -3 dB, a bit-error-rate of 10-11 is obtained compared to 10-4 without BSS.
Year
DOI
Venue
2015
10.1109/TCSII.2015.2415258
Circuits and Systems II: Express Briefs, IEEE Transactions  
Keywords
Field
DocType
3D integrated circuits,blind source separation,crosstalk rejection,inter-chip Communication
Coupling,Crosstalk,Permutation,Communication channel,Integrator,Electronic engineering,Blind signal separation,Mathematics,Swing,Bounding overwatch
Journal
Volume
Issue
ISSN
PP
99
1549-7747
Citations 
PageRank 
References 
0
0.34
8
Authors
4
Name
Order
Citations
PageRank
Kamal El-Sankary100.34
Tetsuya Asai212126.53
Masato Motomura39127.81
Tadahiro Kuroda4659213.23