Title
Enhancement of simulation-based semiconductor manufacturing forecast quality through hybrid tool down time modeling
Abstract
Material flow forecast based on Short-Term Simulation has been established as a decision support solution for fine-tuning of Preventive Maintenance (PM) timing at Infineon Dresden. To ensure stable forecast quality for effective PM decision making, the typical tool uptime behavior needs to be portrayed accurately. In this paper, we present a hybrid tool down modeling approach that selectively combines deterministic and random down time modeling based on historical tool uptime behavior. The method allowed to approximate the daily uptime of reality in simulation. A generic framework to model historical down behavior of any distribution type, described by the two parameters Mean Time to Failure (MTTF) and Mean Time to Repair (MTTR) is also discussed.
Year
DOI
Venue
2014
10.1109/WSC.2014.7020088
Winter Simulation Conference
Keywords
Field
DocType
infineon dresden,forecasting theory,decision making,quality control,mean-time-to-repair,decision support solution,failure analysis,semiconductor device manufacture,quality forecasting,short-term simulation,preventive maintenance,mean-time-to-failure,semiconductor manufacturing,hybrid tool down time modeling,material flow forecasting
Mean time between failures,Computer science,Simulation,Decision support system,Semiconductor device fabrication,Mean time to repair,Material flow,Downtime,Reliability engineering,Preventive maintenance
Conference
ISSN
ISBN
Citations 
0891-7736
978-1-4673-9741-4
0
PageRank 
References 
Authors
0.34
1
5
Name
Order
Citations
PageRank
Patrick Preuss1124.16
André Naumann201.69
Wolfgang Scholl3628.06
Boon-Ping Gan4689.08
Peter Lendermann521925.96