Title
Statistical silicon results of dynamic power integrity control of ATE for eliminating overkills and underkills
Abstract
This paper demonstrates our dynamic power integrity control for eliminating the overkills/underkills due to the difference of power supply impedance between an automatic test equipment (ATE) and a practical operating environment of the device under test (DUT). It injects compensation currents into the power supply nodes on the ATE system in a feed-forward manner such that the ATE power supply waveform matches with the one on the customer's operating environment of the DUT. Experimental results of delay fault testing with 105 real silicon chips show that 48% of overkills/underkills due to the different power supply characteristics can be eliminated by our dynamic power integrity control. Furthermore, it was found that adjusting the magnitude of the power integrity control based on the chip-to-chip active power variation improves the correlation of the test results between the ATE and the customer environment, resulting in 95% of the overkills/underkills can be eliminated.
Year
DOI
Venue
2014
10.1109/TEST.2014.7035299
Test Conference
Keywords
Field
DocType
automatic test equipment,compensation,feedforward,power aware computing,power supply circuits,ATE power supply waveform,ATE system,DUT,automatic test equipment,chip-to-chip active power variation,compensation currents,delay fault testing,device under test,dynamic power integrity control,feedforward manner,overkills,power supply impedance,power supply nodes,practical operating environment,silicon chips,statistical silicon results,underkills
Computer science,Automatic test equipment,Power integrity,Power factor,Electronic engineering,AC power,Dynamic demand,Power supply rejection ratio,Switched-mode power supply,Switched-mode power supply applications
Conference
ISSN
Citations 
PageRank 
1089-3539
3
0.52
References 
Authors
3
4
Name
Order
Citations
PageRank
Ishida, M.130.52
Takashi Kusaka256.50
Nakura, T.3111.25
Komatsu, S.4121.78