Title
An MOS transistor charge model for VLSI design
Abstract
The development of an MOS transistor charge and capacitance model for the analysis and design of VLSI circuits is described. The total stored charge in each of the gate, bulk, and channel regions is obtained by integrating the distributed charge densities over the thin-oxide area. Charge conservation is guaranteed in this model by using the terminal charges as the state variables. The capacitance expressions have the nonreciprocal property. Partition of channel charge into the drain and source components is 40/60 in the saturation region. In the triode region, this partition changes asymptotically to 50/50 as the gate voltage increases. The carrier-velocity saturation effect is incorporated through both the modification of channel quasi-Fermi level and the determination of drain saturation voltage. Implementation of the model in the SPICE circuit simulator has been achieved. Modeled results compare well with experimental data for transistors with channel lengths as small as 0.75 μm
Year
DOI
Venue
1988
10.1109/43.3186
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions  
Keywords
DocType
Volume
VLSI,digital simulation,insulated gate field effect transistors,semiconductor device models,0.75 micron,MOS transistor charge model,SPICE circuit simulator,VLSI design,bulk region,capacitance model,carrier-velocity saturation effect,channel charge partition,channel lengths,channel region,charge conservation,distributed charge densities,drain saturation voltage,experimental data,gate region,modification of channel quasi-Fermi level,saturation region,terminal charges,thin-oxide area,total stored charge,triode region
Journal
7
Issue
ISSN
Citations 
4
0278-0070
15
PageRank 
References 
Authors
2.32
0
3
Name
Order
Citations
PageRank
B. J. Sheu112928.40
Hsu, W.-J.2152.32
P. K. Ko3215.80