Name
Abstract | ||
|---|---|---|
The production of wafer-scale transducer arrays using laser interconnection techniques and micromatching technology is discussed. The design of a wafer-scale thermal dynamic scene simulator that was implemented using the laser-linking redundancy technique is presented to illustrate typical design requirements. The simulator uses small arrays of thermal pixels and control circuitry in 3 mu m CMOS technology.<> |
Year | DOI | Venue |
|---|---|---|
1992 | 10.1109/2.129048 | IEEE Computer |
Keywords | DocType | Volume |
CMOS integrated circuits,VLSI,image sensors,infrared detectors,micromechanical devices,transducers,3 micron,CMOS technology,laser interconnection techniques,micromatching technology,redundancy technique,thermal dynamic scene simulator,thermal pixels,wafer-scale transducer arrays | Journal | 25 |
Issue | ISSN | Citations |
4 | 0018-9162 | 3 |
PageRank | References | Authors |
0.65 | 1 | 3 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Glenn H. Chapman | 1 | 167 | 34.10 |
| Parameswaran, M. | 2 | 3 | 0.65 |
| Marek Syrzycki | 3 | 17 | 4.60 |