Title
Fault-Tolerant Design for VLSI: Effect of Interconnect Requirements on Yield Improvement of VLSI Designs
Abstract
In order to take full advantage of VLSI, new design methods are necessary to improve the yield and testability. Designs which incorporate redundancy to improve the yields of high density memory chips are well known. The goal of this paper is to motivate the extension of this technique to other types of VLSI logic circuits. The benefits and the limitations of on-chip modularization and the use of spare elements are presented, and significant yield improvements are shown to be possible.
Year
DOI
Venue
1982
10.1109/TC.1982.1676058
Computers, IEEE Transactions
Keywords
Field
DocType
Interconnect area estimates,VLSI fault tolerance,VLSI yield improvement,redundancy partitioning,redundancy placement,regular designs,Interconnect area estimates,VLSI fault tolerance,VLSI yield improvement,redundancy partitioning,redundancy placement,regular designs
Testability,Logic gate,Spare part,Computer science,Parallel computing,Design methods,Fault tolerance,Redundancy (engineering),Modular programming,Very-large-scale integration
Journal
Volume
Issue
ISSN
C
7
0018-9340
Citations 
PageRank 
References 
49
7.12
5
Authors
2
Name
Order
Citations
PageRank
Mangir, T.E.17512.36
Algirdas Avizienis23116351.14