Title
Origin of physical degradation in AlGaN/GaN on Si high electron mobility transistors under reverse bias stressing
Abstract
We have investigated the role of threading dislocations in pit formation during stressing of AlGaN/GaN on Si high electron mobility transistors under high reverse bias. Upon stressing, the drain current saturation (ID-saturation) decreases over time. The amount of ID-saturation degradation correlates well with pit formation at the gate-edge, where the electric field is the highest. Using a transmission electron microscope weak-beam technique, it is found that pits tend to nucleate at threading dislocations that have a screw component, even when these dislocations are at locations away from the gate-edge. An explanation based on an electrochemical oxidation model is proposed.
Year
DOI
Venue
2015
10.1109/IRPS.2015.7112768
Reliability Physics Symposium
Keywords
Field
DocType
iii-v semiconductors,aluminium compounds,electric fields,gallium compounds,high electron mobility transistors,silicon,transmission electron microscopy,wide band gap semiconductors,algan-gan,si,drain current saturation,electric field,electrochemical oxidation model,gate-edge,high electron mobility transistor,physical degradation,pit formation,reverse bias stressing,threading dislocation,transmission electron microscope weak-beam technique,algan/gan,hemt,reliability,threading dislocations,degradation,logic gates
Gallium nitride,Electric field,Nucleation,Transmission electron microscopy,Electronic engineering,Engineering,Dislocation,Transistor,Electron mobility,Silicon
Conference
ISSN
Citations 
PageRank 
1541-7026
2
0.80
References 
Authors
0
4
Name
Order
Citations
PageRank
Sasangka, W.A.132.25
Syaranamual, G.J.232.25
Chee Lip Gan34210.12
Thompson, Carl V.45011.56