Name
Title | ||
|---|---|---|
Thermal-Aware Small-Delay Defect Testing in Integrated Circuits for Mitigating Overkill. |
Abstract | ||
|---|---|---|
At-speed testing of deep-submicrometer or nano-scale integrated circuits (ICs) consumes excessive power and creates hotspots and temperature gradient in the chip-under-test. The problem worsens for 3-D ICs, where heat dissipation across layers is more unbalanced. These hotspots in a circuit often cause severe degradation of performance and reliability, as a rise in temperature can introduce an ext... |
Year | DOI | Venue |
|---|---|---|
2016 | 10.1109/TCAD.2015.2474365 | IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems |
Keywords | Field | DocType |
Delays,Testing,Thermal analysis,Circuit faults,Computer architecture | Thermal,Computer science,Thermal management of electronic devices and systems,Electronic engineering,Real-time computing,Temperature gradient,Thermal analysis,Integrated circuit,Reliability engineering | Journal |
Volume | Issue | ISSN |
35 | 3 | 0278-0070 |
Citations | PageRank | References |
5 | 0.41 | 34 |
Authors | ||
5 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Dong Xiang | 1 | 528 | 48.34 |
| Kele Shen | 2 | 29 | 5.51 |
| Bhargab B. Bhattacharya | 3 | 848 | 118.02 |
| Xiaoqing Wen | 4 | 790 | 77.12 |
| Xijiang Lin | 5 | 687 | 42.03 |