Title
Simulation model to control risk levels on process equipment through metrology in semiconductor manufacturing.
Abstract
This paper first presents a simulation model implemented to study a specific workcenter in semiconductor manufacturing facilities (fabs) with the objective of controlling the risk on process equipment. The different components of the model, its inputs and its outputs, that led us to propose improvements in the workcenter, are explained. The risk evaluated in this study is the exposure level in the number of wafers on a process tool since the latest control performed for this tool, based on an indicator called Wafer at Risk (W@R). Our analysis shows that measures should be better managed to avoid lack of control and that an appropriate qualification strategy is required.
Year
DOI
Venue
2015
10.1109/WSC.2015.7408397
Winter Simulation Conference
Field
DocType
ISSN
Wafer,Systems engineering,Computer science,Metrology,Semiconductor device fabrication,Manufacturing engineering,Audit risk
Conference
0891-7736
ISBN
Citations 
PageRank 
978-1-4673-9741-4
1
0.41
References 
Authors
3
3
Name
Order
Citations
PageRank
Alejandro Sendón110.41
Stéphane Dauzère-Pérès274065.50
Jacques Pinaton31912.98