Name
Abstract | ||
|---|---|---|
The Intel® Omni-Path Architecture (Intel® OPA) is designed to enable a broad class of computations requiring scalable, tightly coupled CPU, memory, and storage resources. Integration between devices in the Intel® OPA family and Intel® CPUs enable improvements in system level packaging and network efficiency. When coupled with the new user-focused open standard APIs developed by the OpenFabrics Alliance (OFA) Open Fabrics Initiative (OFI), host fabric interfaces (HFIs) and switches in the Intel® OPA family are optimized to provide low latency, high bandwidth, and high message rate. Intel® OPA provides important innovations to enable a multi-generation, scalable fabric, including: link layer reliability, extended fabric addressing, and optimizations for high core count CPUs. Datacenter needs are also a core focus for Intel® OPA, which includes: link level traffic flow optimization to minimize datacenter jitter for high priority packets, robust partitioning support, quality of service support, and a centralized fabric management system. Basic performance metrics from first generation HFI and switch implementations demonstrate the potential of the new fabric architecture. |
Year | DOI | Venue |
|---|---|---|
2015 | 10.1109/HOTI.2015.22 | Symposium on High-Performance Interconnects |
Keywords | Field | DocType |
fabric, high performance computing, datacenter, scalability, reliability | Supercomputer,Computer science,Link level,Network packet,Computer network,Quality of service,Link layer,Latency (engineering),Jitter,Scalability,Embedded system | Conference |
ISSN | Citations | PageRank |
1550-4794 | 30 | 1.26 |
References | Authors | |
3 | 8 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Mark S. Birrittella | 1 | 30 | 1.26 |
| Mark Debbage | 2 | 30 | 1.60 |
| Ram Huggahalli | 3 | 358 | 20.94 |
| James Kunz | 4 | 30 | 1.26 |
| Tom Lovett | 5 | 30 | 1.26 |
| Todd Rimmer | 6 | 30 | 1.26 |
| Keith D. Underwood | 7 | 847 | 77.39 |
| Robert C. Zak | 8 | 30 | 1.26 |