Title
2.31-Gb/s/ch Area-Efficient Crosstalk Canceled Hybrid Capacitive Coupling Interconnect for 3-D Integration.
Abstract
This paper introduces a hybrid capacitive coupling interconnects (CCIs) array suitable for bumpless flip-chip 3-D integration. Inside the hybrid array, both single-ended and common-centroid differential CCIs are interleaved together to cancel the crosstalk among them. The crosstalk cancellation capability of its own allows CCIs to be placed closer and thus improves the area efficiency. A high gain...
Year
DOI
Venue
2016
10.1109/TVLSI.2016.2516520
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Keywords
Field
DocType
Crosstalk,Arrays,Couplings,Receivers,Transceivers,Integrated circuit interconnections,Capacitance
Transceiver,Coupling,Computer science,Electronic engineering,CMOS,Chip,Hybrid array,Process variation,Jitter,Electrical engineering,Capacitive coupling
Journal
Volume
Issue
ISSN
24
8
1063-8210
Citations 
PageRank 
References 
3
0.42
14
Authors
4
Name
Order
Citations
PageRank
Myat Thu Linn Aung1112.69
Teck Heng Lim230.42
Takefumi Yoshikawa3186.62
Tae-hyoung Kim416335.19