Title
A Built-In Test Circuit For Electrical Interconnect Testing Of Open Defects In Assembled Pcbs
Abstract
In this paper, a built-in test circuit for an electrical interconnect test method is proposed to detect an open defect occurring at an interconnect between an IC and a printed circuit board. The test method is based on measuring the supply current of an inverter gate in the test circuit. A time-varying signal is provided to an interconnect as a test signal by the built-in test circuit. In this paper, the test circuit is evaluated by SPICE simulation and by experiments with a prototyping IC. The experimental results reveal that a hard open defect is detectable by the test method in addition to a resistive open defect and a capacitive open one at a test speed of 400 kHz.
Year
DOI
Venue
2016
10.1587/transinf.2015EDP7273
IEICE TRANSACTIONS ON INFORMATION AND SYSTEMS
Keywords
Field
DocType
electrical test, built-in test circuit, open defect, interconnect test, design for testability
Design for testing,Interconnect test,Computer science,Interconnection,Embedded system
Journal
Volume
Issue
ISSN
E99D
11
1745-1361
Citations 
PageRank 
References 
0
0.34
2
Authors
7
Name
Order
Citations
PageRank
Widianto100.34
Masaki Hashizume29827.83
Shohei Suenaga300.34
Hiroyuki Yotsuyanagi421.41
A Ono52131.32
Shyue-Kung Lu625934.09
Zvi S. Roth711019.78