Title | ||
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Inter/intra-chip optical interconnection network: opportunities, challenges, and implementations |
Abstract | ||
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Recent advances in photonics technologies have made optical interconnection network an attractive option for computing systems from high-performance computers and data centers to automobiles and cellphones. Optical interconnection network promises ultra-high bandwidth, low latency, and great energy efficiency to alleviate the inter-rack, intra-rack, intraboard, and intra-chip communication bottlenecks in multiprocessor systems. Silicon-based photonics technologies piggyback onto developed silicon fabrication processes to provide viable and cost-effective solutions. Both industry and academia have invested significant efforts to develop and commercialize optical interconnection network technologies. This paper reviews the latest progresses and provides insights into the challenges and future developments. |
Year | DOI | Venue |
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2016 | 10.1109/NOCS.2016.7579343 | 2016 Tenth IEEE/ACM International Symposium on Networks-on-Chip (NOCS) |
Keywords | Field | DocType |
inter-intra-chip optical interconnection network,high-performance computers,data centers,automobiles,cell phones,energy efficiency,ultra-high bandwidth,silicon-based photonics technology,silicon fabrication processes,Si | Telecommunications,Optical switch,Computer science,Efficient energy use,Waveguide (optics),Implementation,Bandwidth (signal processing),Optical performance monitoring,Latency (engineering),Photonics | Conference |
ISBN | Citations | PageRank |
978-1-4673-9031-6 | 1 | 0.38 |
References | Authors | |
23 | 9 |
Name | Order | Citations | PageRank |
---|---|---|---|
Peng Yang | 1 | 64 | 10.97 |
Shigeru Nakamura | 2 | 2 | 1.07 |
Kenichiro Yashiki | 3 | 1 | 0.38 |
Zhehui Wang | 4 | 262 | 24.56 |
Luan H. K. Duong | 5 | 64 | 9.36 |
Zhifei Wang | 6 | 27 | 7.86 |
Xuanqi Chen | 7 | 6 | 5.31 |
Yuichi Nakamura | 8 | 1 | 0.72 |
Jiang Xu | 9 | 704 | 61.98 |