Title
Inter/intra-chip optical interconnection network: opportunities, challenges, and implementations
Abstract
Recent advances in photonics technologies have made optical interconnection network an attractive option for computing systems from high-performance computers and data centers to automobiles and cellphones. Optical interconnection network promises ultra-high bandwidth, low latency, and great energy efficiency to alleviate the inter-rack, intra-rack, intraboard, and intra-chip communication bottlenecks in multiprocessor systems. Silicon-based photonics technologies piggyback onto developed silicon fabrication processes to provide viable and cost-effective solutions. Both industry and academia have invested significant efforts to develop and commercialize optical interconnection network technologies. This paper reviews the latest progresses and provides insights into the challenges and future developments.
Year
DOI
Venue
2016
10.1109/NOCS.2016.7579343
2016 Tenth IEEE/ACM International Symposium on Networks-on-Chip (NOCS)
Keywords
Field
DocType
inter-intra-chip optical interconnection network,high-performance computers,data centers,automobiles,cell phones,energy efficiency,ultra-high bandwidth,silicon-based photonics technology,silicon fabrication processes,Si
Telecommunications,Optical switch,Computer science,Efficient energy use,Waveguide (optics),Implementation,Bandwidth (signal processing),Optical performance monitoring,Latency (engineering),Photonics
Conference
ISBN
Citations 
PageRank 
978-1-4673-9031-6
1
0.38
References 
Authors
23
9
Name
Order
Citations
PageRank
Peng Yang16410.97
Shigeru Nakamura221.07
Kenichiro Yashiki310.38
Zhehui Wang426224.56
Luan H. K. Duong5649.36
Zhifei Wang6277.86
Xuanqi Chen765.31
Yuichi Nakamura810.72
Jiang Xu970461.98