Name
Abstract | ||
|---|---|---|
Three-dimensional (3D) integration provides many benefits including high density, high bandwidth and low power consumption. Through-silicon via (TSV), which provides communication links for dies in vertical direction, is a critical design issue in 3D integration. Nevertheless, TSV is susceptible to failure in the fabrication and bonding, which may lead to partial interconnection in vertical direction, and thus can severely increase the cost and decrease the yield. To solve this issue, this paper proposes a TSV fault-tolerant scheme based on failure classification. Specifically,a 32-bit TSV channel is divided into four groups. Based on the results of TSV testing, inter-group TSV serialization, intra-group TSV serialization and localized fault-tolerant routing are proposed to solve different TSV failure classifications. By comparing with the existing works, the experiment results show the superiority of the proposed method in improving the overall network performance with an acceptable area and power overhead. |
Year | DOI | Venue |
|---|---|---|
2017 | 10.1142/S0218126617500591 | JOURNAL OF CIRCUITS SYSTEMS AND COMPUTERS |
Keywords | Field | DocType |
3D-NoC,TSV failure,serialization,localized fault-tolerant routing | Serialization,Computer science,Vertical direction,High density,Communication channel,Fault tolerance,Interconnection,Network performance,Power consumption,Embedded system | Journal |
Volume | Issue | ISSN |
26 | 4 | 0218-1266 |
Citations | PageRank | References |
2 | 0.39 | 7 |
Authors | ||
6 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Yiming Ouyang | 1 | 13 | 4.38 |
| Jian Da | 2 | 2 | 0.39 |
| Xiumin Wang | 3 | 107 | 5.09 |
| Qianqian Han | 4 | 2 | 0.39 |
| Huaguo Liang | 5 | 216 | 33.27 |
| Gaoming Du | 6 | 4 | 0.77 |