Name
Affiliation
Papers
HUAGUO LIANG
Hefei University of Technology Department of Computer and Information 230009 Hefei P.R. China
76
Collaborators
Citations 
PageRank 
168
216
33.27
Referers 
Referees 
References 
402
938
478
Search Limit
100938
Title
Citations
PageRank
Year
A reconfigurable PUF structure with dual working modes based on entropy separation model00.342022
Design of True Random Number Generator Based on Multi-Stage Feedback Ring Oscillator00.342022
A Low Power-Consumption Triple-Node-Upset-Tolerant Latch Design00.342022
Low-Power Anti-Glitch Double-Edge Triggered Flip-Flop Based on Robust C-Elements00.342022
A reconfigurable test method based on LFSR for 3D stacking integrated circuits00.342022
High-Throughput Portable True Random Number Generator Based on Jitter-Latch Structure20.362021
A Cost-Effective TSV Repair Architecture for Clustered Faults in 3-D IC10.362021
Design of node separated triple-node-upset self-recoverable latch00.342021
Architecting a priority-based dynamic media access control mechanism in Wireless Network-on-Chip00.342021
LC-TSL: A low-cost triple-node-upset self-recovery latch design based on heterogeneous elements for 22 nm CMOS00.342021
A high reliability physically unclonable function based on multiple tunable ring oscillator00.342021
Pure Digital Scalable Mixed Entropy Separation Structure for Physical Unclonable Function and True Random Number Generator10.362021
Reliability Evaluation and Analysis of FPGA-Based Neural Network Acceleration System20.372021
Design of MNU-Resilient latches based on input-split C-elements00.342021
A high-speed and triple-node-upset recovery latch with heterogeneous interconnection00.342021
Approximate multipliers based on a novel unbiased approximate 4-2 compressor00.342021
Chip Test Pattern Reordering Method Using Adaptive Test To Reduce Cost For Testing Of Ics00.342021
Non-Intrusive Online Distributed Pulse Shrinking-Based Interconnect Testing in 2.5D IC40.402020
Cm < Sup > 3 </Sup > Winocs: Congestion-Aware Millimeter-Wave Multichannel Wireless Networks-On-Chip00.342020
LCHR-TSV: Novel Low Cost and Highly Repairable Honeycomb-Based TSV Redundancy Architecture for Clustered Faults60.542020
A Hybrid Computing Architecture for Fault-tolerant Deep Learning Accelerators00.342020
Multi-task Scheduling for PIM-based Heterogeneous Computing System00.342020
Architecture of Cobweb-Based Redundant TSV for Clustered Faults80.552020
Design of a Wireless Router with Virtual Channel Fault Tolerant in WiNoC00.342020
A Novel Low-Latency Regional Fault-Aware Fault-Tolerant Routing Algorithm for Wireless NoC.10.392020
Dual-Interlocked-Storage-Cell-Based Double-Node-Upset Self-Recoverable Flip-Flop Design for Safety-Critical Applications00.342020
Retraction: Reliability Assurance In Early-Life-Failure Test Through Improved Nearest Neighbor Regression (Retraction Of Vol 17, Pg 531, 2020)00.342020
Novel Application of Deep Learning for Adaptive Testing Based on Long Short-Term Memory00.342019
A Pulse Shrinking-based Test Solution for Pre-bond Through Silicon Via in 3D ICs10.362019
Design of Wireless Network on Chip with Priority-Based MAC00.342019
A Novel Triple-Node-Upset-Tolerant CMOS Latch Design using Single-Node-Upset-Resilient Cells00.342019
CPCA: An efficient wireless routing algorithm in WiNoC for cross path congestion awareness00.342019
DVFS Based Error Avoidance Strategy in Wireless Network-on-Chip00.342019
Temperature-Aware Floorplanning For Fixed-Outline 3d Ics00.342019
A Hybrid DMR Latch to Tolerate MNU Using TDICE and WDICE00.342018
An All-Digital and Jitter-Quantizing True Random Number Generator in SRAM-Based FPGAs00.342018
An improved communication scheme for non-HOL-blocking wireless NoC.00.342018
MTTF-Aware Reliability Task Scheduling for PIM-Based Heterogeneous Computing System00.342018
A High Reliability FPGA Chip Identification Generator Based on PDLs00.342018
A Dictionary-Based Test Data Compression Method Using Tri-State Coding00.342018
A Low-Cost High-Efficiency True Random Number Generator on FPGAs00.342018
Design of Low-Power WiNoC with Congestion-Aware Wireless Node.00.342018
Highly Robust Double Node Upset Resilient Hardened Latch Design00.342017
Vernier Ring Based Pre-Bond Through Silicon Vias Test In 3d Ics00.342017
A Single Event Transient Detector In Sram-Based Fpgas10.402017
A TSV Fault-Tolerant Scheme Based on Failure Classification in 3D-NoC.20.392017
A Transient Pulse Dually Filterable And Online Self-Recoverable Latch20.472017
A Highly Reliable Butterfly Puf In Sram-Based Fpgas00.342017
Double-Node-Upset-Resilient Latch Design for Nanoscale CMOS Technology.60.482017
A Region-Based Through-Silicon Via Repair Method For Clustered Faults00.342017
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