Name
Abstract | ||
|---|---|---|
Solutions to the integration challenges of a new thermal sensor technology into 3-D integrated circuits (ICs) will be discussed in this paper. Our proposed architecture uses bimetallic thin-film thermocouples, which are thermally linked to points of measurement throughout the 3-D stack with dedicated vias. These vias will be similar to thermal through-silicon vias (TSVs) in structure, yet differen... |
Year | DOI | Venue |
|---|---|---|
2017 | 10.1109/TVLSI.2017.2699040 | IEEE Transactions on Very Large Scale Integration (VLSI) Systems |
Keywords | Field | DocType |
Temperature sensors,Through-silicon vias,Temperature measurement,Monitoring | Thermal,Thermocouple,End-to-end principle,Modeling and simulation,Computer science,Correctness,Electronic engineering,Wireless sensor network,Temperature measurement,Integrated circuit,Electrical engineering | Journal |
Volume | Issue | ISSN |
25 | 9 | 1063-8210 |
Citations | PageRank | References |
0 | 0.34 | 19 |
Authors | ||
4 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Dawei Li | 1 | 7 | 2.23 |
| Siddhartha Joshi | 2 | 2 | 2.10 |
| Jihoon Kim | 3 | 169 | 34.38 |
| Seda Ogrenci Memik | 4 | 0 | 0.68 |