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Name
Affiliation
Papers
DAWEI LI
Northwestern Univ, Dept Elect Engn & Comp Sci, Chicago, IL 60208 USA
6
Collaborators
Citations
PageRank
15
7
2.23
Referers
Referees
References
27
162
54
Search Limit
100
162
Publications (6 rows)
Collaborators (15 rows)
Referers (27 rows)
Referees (100 rows)
Title
Citations
PageRank
Year
End-to-End Analysis of Integration for Thermocouple-Based Sensors Into 3-D ICs.
0
0.34
2017
A content addressable memory with multi-Vdd scheme for low power tunable operation
0
0.34
2017
A methodology for power characterization of associative memories
2
0.41
2015
On-Chip Integration Of Thermoelectric Energy Harvesting In 3d Ics
0
0.34
2015
Theory and Analysis for Optimization of On-Chip Thermoelectric Cooling Systems
2
0.41
2013
Integrating thermocouple sensors into 3D ICs
3
0.40
2013
1