Paper Info
Title
Scheduling Single-Armed Cluster Tools With Chamber Cleaning Operations.
Abstract
As wafer circuit widths shrink down, wafer fabrication processes require stringent quality control. Therefore, fabs recently tend to clean a chamber after processing each wafer, in order to remove chemical residuals within the chamber. Such chamber cleaning, called purge operation, increases scheduling complexity in robotized cluster tools. In this paper, we examine scheduling problems of single-a...
Year
DOI
Venue
2018
10.1109/TASE.2017.2682271
IEEE Transactions on Automation Science and Engineering
Keywords
Field
DocType
Cleaning,Robots,Loading,Job shop scheduling,Chemicals,Chemical vapor deposition,Load modeling
Wafer,Residual,Job shop scheduling,Computer science,Scheduling (computing),Load modeling,Control engineering,Real-time computing,Process control,Throughput,Robot,Embedded system
Journal
Volume
Issue
ISSN
15
2
1545-5955
Citations 
PageRank 
References 
2
0.36
0
Authors
3
Name
Order
Citations
PageRank
Tae-Sun Yu1113.85
Hyun-Jung Kim2242.09
Tae-Eog Lee328530.02