Name
Abstract | ||
|---|---|---|
Interposers play an important role in integrating multiple dies in a staked-die product. Prebond testing of interposers is an essential process for improving production yield. However, the traditional testing mechanism via probing is not appropriate, since it could destroy the fragile interposers. To this end, we propose a contactless testing methodology for prebond interposers. The testing method... |
Year | DOI | Venue |
|---|---|---|
2018 | 10.1109/TVLSI.2018.2805850 | IEEE Transactions on Very Large Scale Integration (VLSI) Systems |
Keywords | Field | DocType |
Testing,Heating systems,Surface treatment,Feature extraction,Surface cracks,Image segmentation,Production | Computer science,Image segmentation,Feature extraction,Electronic engineering,Interposer,Die (manufacturing) | Journal |
Volume | Issue | ISSN |
26 | 6 | 1063-8210 |
Citations | PageRank | References |
0 | 0.34 | 0 |
Authors | ||
4 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Kai-Hsiang Hsu | 1 | 0 | 0.34 |
| Yung-Chih Chen | 2 | 413 | 39.89 |
| You-Luen Lee | 3 | 3 | 1.07 |
| Shih-Chieh Chang | 4 | 641 | 52.31 |