Title | ||
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New defect detection approach using near electromagnetic field probing of high density PCBAs. |
Abstract | ||
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With the density increase of today's printed circuit board assemblies (PCBA), the electronic fault detection methods reached their limits. In the same time the requirements of high reliability and robustness are greater. Industrials are obliged to find better-adapted test methods. Current test methods must be rethought to include a large panel of physical phenomena that can be used to detect electrical defects of components, absence, wrong value, and shorts at component level on the board under test (BUT). |
Year | DOI | Venue |
---|---|---|
2018 | 10.1016/j.microrel.2018.07.090 | Microelectronics Reliability |
Keywords | Field | DocType |
Testability,Accessibility,PCB assembly production test,Near field probes,Magnetic sensors,Giant magnetoresistance,In-circuit test,Design for Testability,Contactless testing,High density PCBA testing | Testability,Design for testing,Magnetic field,Fault detection and isolation,In-circuit test,Printed circuit board,Robustness (computer science),Electronic engineering,Engineering,Electromagnetic field | Journal |
Volume | ISSN | Citations |
88 | 0026-2714 | 0 |
PageRank | References | Authors |
0.34 | 0 | 4 |
Name | Order | Citations | PageRank |
---|---|---|---|
Nabil El Belghiti Alaoui | 1 | 1 | 0.96 |
Alexandre Boyer | 2 | 19 | 6.90 |
Patrick Tounsi | 3 | 11 | 4.78 |
Arnaud Viard | 4 | 1 | 1.64 |