Title
New defect detection approach using near electromagnetic field probing of high density PCBAs.
Abstract
With the density increase of today's printed circuit board assemblies (PCBA), the electronic fault detection methods reached their limits. In the same time the requirements of high reliability and robustness are greater. Industrials are obliged to find better-adapted test methods. Current test methods must be rethought to include a large panel of physical phenomena that can be used to detect electrical defects of components, absence, wrong value, and shorts at component level on the board under test (BUT).
Year
DOI
Venue
2018
10.1016/j.microrel.2018.07.090
Microelectronics Reliability
Keywords
Field
DocType
Testability,Accessibility,PCB assembly production test,Near field probes,Magnetic sensors,Giant magnetoresistance,In-circuit test,Design for Testability,Contactless testing,High density PCBA testing
Testability,Design for testing,Magnetic field,Fault detection and isolation,In-circuit test,Printed circuit board,Robustness (computer science),Electronic engineering,Engineering,Electromagnetic field
Journal
Volume
ISSN
Citations 
88
0026-2714
0
PageRank 
References 
Authors
0.34
0
4
Name
Order
Citations
PageRank
Nabil El Belghiti Alaoui110.96
Alexandre Boyer2196.90
Patrick Tounsi3114.78
Arnaud Viard411.64