Title
Wafer-Level Contactless Testing Based on UHF RFID Tags With Post-Process On-Chip Antennas.
Abstract
This brief demonstrates a fully contactless wafer-level testing based on UHF radio identification (RFID) technology enriched by high-quality on-chip antenna. The antenna, which uses exactly the same tag IC area (i.e., 0.45 mm2), exploits a low-cost post-process consisting of a thick dielectric layer and a copper metal, thus significantly improving the quality factor with respect to a standard CMOS...
Year
DOI
Venue
2018
10.1109/TCSII.2018.2852949
IEEE Transactions on Circuits and Systems II: Express Briefs
Keywords
Field
DocType
Antennas,Testing,Integrated circuits,Radiofrequency identification,Couplings,Silicon,Q-factor
Wafer,Q factor,Coupling,General purpose,Inductive coupling,Electronic engineering,CMOS,Integrated circuit,Ultra high frequency,Electrical engineering,Mathematics
Journal
Volume
Issue
ISSN
65
10
1549-7747
Citations 
PageRank 
References 
1
0.36
0
Authors
6
Name
Order
Citations
PageRank
Alessandro Finocchiaro1455.12
G. Girlando271.86
Alessandro Motta310.70
A. Pagani431.80
Egidio Ragonese54712.65
giuseppe palmisano6133.63