Name
Title | ||
|---|---|---|
Electromagnetic modeling and analysis of the tapered differential through glass vias. |
Abstract | ||
|---|---|---|
An analytic model of the tapered differential through glass vias is proposed in this paper. Each expression accounting for the via length, diameter, slope angle and pitch is derived from basic physics and the IMD layer is included, additionally. The RLGC equivalent circuit is verified by comparing the S-parameters resulted from the 3-D full-wave electromagnetic solver High Frequency Simulator Structure (HFSS) and Advanced Design System (ADS). The feature selective validation (FSV) technique is used to as a measure of the comparisons. The proposed model and HFSS results show accordance with each other up to 20 GHz The excellent transmission characteristics of glass substrate reflect from S-parameters, of which the S21 is about the order of magnitude of 10−3 dB and the S11 is lower than −30 dB till 20 GHz. Moreover, the impact of different configuration on transmission coefficient is investigated. |
Year | DOI | Venue |
|---|---|---|
2019 | 10.1016/j.mejo.2018.11.005 | Microelectronics Journal |
Keywords | Field | DocType |
3D ICs,Glass interposer,Differential through glass vias,Equivalent-circuit model | Electromagnetic solver,Computational electromagnetics,Transmission coefficient,HFSS,Design systems,Electronic engineering,Acoustics,Engineering,Analytic model,Order of magnitude,Equivalent circuit | Journal |
Volume | ISSN | Citations |
83 | 0026-2692 | 0 |
PageRank | References | Authors |
0.34 | 1 | 7 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Yang Liu | 1 | 13 | 6.37 |
| Zhangming Zhu | 2 | 294 | 82.36 |
| Xiaoxian Liu | 3 | 4 | 2.45 |
| Qijun Lu | 4 | 1 | 1.37 |
| Xiangkun Yin | 5 | 3 | 0.91 |
| Li-Xin Guo | 6 | 12 | 16.42 |
| Yin-Tang Yang | 7 | 334 | 92.74 |