Author Info
Name
Affiliation
Papers
XIANGKUN YIN
Xidian Univ, Sch Microelect, Xian 710071, Shaanxi, Peoples R China
2
Collaborators
Citations 
PageRank 
8
3
0.91
Referers 
Referees 
References 
4
17
4
Title
Citations
PageRank
Year
Electromagnetic modeling and analysis of the tapered differential through glass vias.00.342019
Effects Of Coaxial Through-Silicon Via On Carrier Mobility Along [100] And [110] Crystal Directions Of (100) Silicon30.572015