Title
TEI-ULP: Exploiting Body Biasing to Improve the TEI-Aware Ultra-Low Power Methods
Abstract
Temperature effect inversion (TEI) phenomenon in ultralow power (ULP) very large scale integration circuits has been identified as an important effect by both academia and industry. Although a number of ULP methods that attempt to exploit the TEI phenomenon have been proposed, the small size of the design exploration space when applying these methods to ULP circuits hinders them from achieving the...
Year
DOI
Venue
2019
10.1109/TCAD.2018.2859240
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Keywords
Field
DocType
Space exploration,Transistors,Very large scale integration,Delays,Aerospace electronics,Low-power electronics,Voltage control
Computer science,Voltage,Electronic engineering,Frequency scaling,Granularity,Transistor,Electronic circuit,Scaling,Very-large-scale integration,Low-power electronics
Journal
Volume
Issue
ISSN
38
9
0278-0070
Citations 
PageRank 
References 
0
0.34
0
Authors
6
Name
Order
Citations
PageRank
Woojoo Lee110410.96
taewook kang294.06
Jae-Jin Lee3278.69
Kyuseung Han4587.86
Joongheon Kim561181.49
Massoud Pedram678011211.32