Title
Special issue on IEEE/ACM System Level Interconnect Prediction (SLIP) Workshop 2016
Year
DOI
Venue
2017
10.1016/j.vlsi.2017.05.003
Integration
Field
DocType
Volume
Computer science,Slip (materials science),Electronic engineering,Real-time computing,Interconnection,Electrical engineering,System level
Journal
58
ISSN
Citations 
PageRank 
0167-9260
0
0.34
References 
Authors
0
2
Name
Order
Citations
PageRank
Tsung-Yi Ho1106195.20
Baris Taskin222740.82