Title
On Delay Measurement Under Delay Variations in Boundary Scan Circuit with Embedded TDC
Abstract
With the high integration of integrated circuits, small delay faults have occurred as the cause of a circuit failure. We have proposed a method for testing small delay faults using a boundary scan circuit with embedded TDC (TDCBS). In this method, delay faults are detected by using the number of stages in which a transition signal has propagated through a delay line. However, there exists delay variation in a delay line. This paper investigated delay variation by measuring transition delay for different paths in the delay line. In addition, to calibrate delay variation, we investigated a calibration method for considering the variation of wire length and delay in a delay line in TDCBS. Measurement results for an experimental chip show that the method can compensate the variations in the delay line.
Year
DOI
Venue
2019
10.1109/ITC-Asia.2019.00042
2019 IEEE International Test Conference in Asia (ITC-Asia)
Keywords
Field
DocType
small delay fault,boundary scan,TDC,design for-testability
Design for testing,Boundary scan,Circuit Failure,Computer science,Chip,Electronic engineering,Integrated circuit,Calibration
Conference
ISBN
Citations 
PageRank 
978-1-7281-4719-2
0
0.34
References 
Authors
7
3
Name
Order
Citations
PageRank
Shuya Kikuchi100.34
Hiroyuki Yotsuyanagi27019.04
Masaki Hashizume39827.83